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IRTronix Design Win Power
Design Wins are the key benchmark of future success for IRTronix
"Do you want to reduce weight, size and improve overall cost?"
IRTronix Provides Bare Die Solution and Distribution
IRTronix Innovative Custom Module Packaging Service
IRTronix launched custom power module packaging service with Seum Corporation in Korea.
International Rectifier Introduces 80V and 100V DirectFET TM MOSFETs
that Reduce 200W Converter Power Loss by 10%

Knowles Acoustics Introduces the 3rd Generation of SiSonic
New "Mini" series, the word' first surface mount MEMS microphones.
 
How to keep engineers happy...
Asia chip market to hit $203B in 2011
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