IRTronix Launches Die Sales Business with International Rectifier

IR power devices in die form help customers gain a competitive edge by reducing weight and size, improving overall cost, enhancing thermal performance and increasing reliability. These enhancements can be an especially critical element of success in the automotive, wireless and industrial control markets.

Why Die?

Improved Performance

• The lower inductance and capacitance of bare die is important in power applications. Signal propagation and power/ground distributions are also improved.
• Shorter electrical length of wirebonds and solder bumps results in lower parasitic inductance.
• Lower capacitance and and less distance between chips leads to improved rise times or lower strength drivers
• Often the package is the limiting factor on performance and not the Die

Size and Weight Reductions

Die Products are the smallest size and lowest weight option.

§ Improvements vary based on the current packaging in use; flip chip can reduce the function footprint by 70% to 90% of the current space requirement. Die products also reduce height which is becoming increasingly important as individual component requirements move from 750mm to less than 300mm

Lower System Costs

· Lower Cost of Ownership

• Most notable in high volume applications where density is required and high yield silicon is implemented. The lower cost of ownership takes into consideration substrate, assembly, system test, equipment utilization, rework and increased product value. In addition, the die product costs are typically lower than the package equivalent.

· Improvements in ownership costs:

• Higher levels of integration
• Substrate size/cost
• Assembly/manufacturing process
• Time to market
• Product value
• Features per die area & weight

Improved Integration

With reduced size and improved substrate pitch, existing product functions provide a low cost, low risk path for the designer to achieve a higher level of integration. Reduced design time is possible utilizing individual die functions in a system in a package (SiP) approach compared to developing system on a chip (SOC) product.

Improved Reliability

The reduced number of interconnects with die use leads to improved reliability. The typical package has three connection points vs. two for wire bonds and a single solder joint with flip chip.

Applications

Applications - White Goods

White Goods : Washing Machines, Tumble driers, Air-conditioning

Need Drivers

High Reliability

– Hostile environment with high temperatures, humidity and vibration

- Low System cost

Very cost sensitive market

- Payback

• Less call out especially as trend is for longer guarantee periods

• Easy mounting of IPM

– Less restrictions on mounting position

- Applications – Automotive

Applications include

• - EHPS (Electronic Hydraulic Power steering
• - EPS (Electric Power Steering
• - Electric Water Pump
• - ISA (Integrated Starter Alternator)
• - ABS (Auto Braking System)
• - ECU (Engine Control Unit)
• - Body Systems

Need Drivers

Higher reliability

• Hostile environment
• Cost of repair extremely high

Low system cost

• Reductions in wire-loom cost as unit can be mounted closer to mechanics

Improved performance

• Lower resistance paths improving on battery drain
• System environmental conditions becoming more stringent putting extreme pressure on discrete packaging technology

Lower weight/size

• Important for close mounting of control near to mechanics

Die Services

Carrier Options

IR can offer a range of carrier options to suite Testingindividual customer needs. Detail

Testing

IR can offer a multitude of different testing options, to meet our customers commercial and technical needs. Detail

Specifications

The specification given in package product Datasheets demonstrates the capability of the Die product. Detail

IR Die Selection Flow

Start off identifying appropriate package part. Detail

Product List

IR's Die Sales Support Team is dedicated to providing the tools and services you need to select, test, characterize and mount IR Die quickly and efficiently, allowing a fast migration into qualification and production. Detail