Custom Modules

“IRTronix launched custom power module packaging service with Seum Corporation”

IRTronix has addressed the need for application specific custom power modules with its Customer Power Products Division. Dedicated specifically to the task of providing cost effective solutions to complex semiconductor applications, IRTronix brings its formidable experience and data base of knowledge to bear on chip manufacturing, electronic materials, and design/engineering techniques.

IRTronix's Custom Power Modules employ the performance proven features of the standard Seum module product line. Soldered-down and wire bonding fabrication and compression bonded encapsulation (CBE) of SCR/Diode elements offer increased switching speeds, lower losses, more efficient cooling, and higher power handling capabilities.

Customizing an electronic package involves the precise selection of many components. High power diodes, SCRs, transistors, Darlington transistors, IGBTs, and MOSFET technology, along with the selection of driver circuits, isolated materials, packages and terminals are key elements in Custom Packaging design. IRTronix has continuing access to the most advanced circuit and chip design through its alliance with Seum Corporation in Korea.

Application Specific Power Module (ASPM)

ASPM Concept: Your Circuit in a Module